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about us

shenzhen chenri technology co., ltd.-世界杯买球分析

year 2004: earlysun technology was officially established

year 2006: semiconductor package high lead solder paste, electronic assembly lead-free halogen-free solder paste

year 2010: develop high-power led solid crystal solder paste and obtain national innovation fund

year 2012: development of fluorescent jelly gel, dam rubber led integrated packaging process and material related invention patent

year 2013: national high-tech enterprise led energy saving and emission reduction project government fund

year 2014: successfully developed high-temperature semiconductor lead-free solder paste and successfully developed led package adhesive

year 2015: development of integrated circuit packaging materials, crystal solder paste obtained from shenzhen technical research project

year 2016: login to the new three board, the market share of solid crystal solder paste is the first. the domestic market share of filament rubber is the first.

year 2017: development of integrated circuit packaging materials, crystal solder paste obtained from shenzhen technical research project

year2018: successfully developed mini printing solid crystal solder paste,successfully developed laser/hotbar machine solder paste

year2019: automotive electronics, 5g field solder paste development

: company overview; development path; company news; enterprise honor

: lead-free solder paste; lead solder paste; cob glue; led filament glue; uv glue、epoxy adhesive、red glue

: engineering solder and alloy; led; pcb assembly

: technical support; sample application; agent recruitment

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