es9611smd red glue is a one-component epoxy resin adhesive that cures rapidly afterheating at room temperature. it allows low temperature stable curing. it canmaintain the shape without drawing, overflowing and collapsing after ultra-highspeed and small amount coating. shear thinning" viscosity characteristicsand low moisture absorption, very suitable for smt process of normaltemperature orifice printing. the shape of the bond points is very easy tocontrol, with good storage stability, thermal shock resistance and electricalproperties, while being safe to use. fully in line with environmentalrequirements.
typical application
beforethe wave soldering, the surface mount component is bonded to the printedcircuit board, which is suitable for low-absorption patch adhesives such asorifice printing to prevent void formation in the cured adhesive.
|
compose |
epoxy resin |
|
surface |
red paste |
|
proportion |
1.24 |
|
dynamic viscosity(25℃下5rpm) |
300pa.s |
|
thixotropic index |
5.9（1rpm/10rpm） |
|
adhesive strength2125c |
44n（45kgf）0.2mgr twin |
|
volumetric impedance coefficient |
3.6×1016ω.cm jis k 9611 |
|
insulation resistance initial value： end value ： |
1.2×1014ω 1.2×1012ω jis z 3197 |
|
dielectric constant |
3.12/1mhz jis k 9611 |
|
dielectric positive connection |
0.012/1mhz jis k 9611 |
|
preservation condition |
5℃以下保存 |
|
condition of cure |
150℃保持120秒以上或者 120℃保持150秒以上 |