l cob enclosure for led surface light
source for ideal wall shape；
l inner layer
bonding for ptc, bonding of electronic, electrical and instrument components；
l used for
bonding, bonding, and fixing various electronic components；
l good adhesion
and moderate strength;
l moisture-proof, waterproof, ozone-resistant, radiation-resistant,
weather-resistant, etc., can withstand high temperatures 260 ° c;
l heated and
cured, and has good adhesion to substrates such as epoxy, glass, and metal.
|
inspecting
item
|
unit / test
method
|
numerical
value
|
|
surface
|
——
|
white paste
|
|
dynamic viscosity
|
mpa·s/(25℃，10rpm)
|
28-35
|
|
tectonic
viscosity ratio
|
/(3rpm/30rpm)
|
>3
|
|
condition of
cure
|
℃/min
|
150/15-30
|
|
operating
time at room temperature
|
hrs./(25℃)
|
48
|
|
storage time
|
months./(-10℃-0℃)
|
6
|
|
density
|
g/cm3
|
1.3
|
|
hardness
|
shore a
|
58-60
|
|
shear strength
|
mpa
|
>1.8
|
|
tensile
strength
|
mpa
|
>3
|
|
mass
resistivity
|
ω·cm/(23℃)
|
0.5×1014
|
|
relative
dielectric constant
|
mhz
|
3.2
|
|
thermal conductivity
|
w/mk
|
0.7
|
|
coefficient of linear expansion
|
ppm/℃(α2)
|
210
|
lcob enclosure for led surface lightsource for ideal wall shape；
linner layerbonding for ptc, bonding of electronic, electrical and instrument components；
lused forbonding, bonding, and fixing various electronic components；
lgood adhesionand moderate strength;
lmoisture-proof,waterproof, ozone-resistant, radiation-resistant, weather-resistant, etc., canwithstand high temperatures 260 ° c;
lheated and cured, and has good adhesion to substrates such as epoxy,glass, and metal.
|
inspecting item
|
unit / test method
|
numerical value
|
|
surface
|
——
|
white paste
|
|
dynamic viscosity
|
mpa·s/(25℃，10rpm)
|
28-35
|
|
tectonic viscosity ratio
|
/(3rpm/30rpm)
|
>3
|
|
condition of cure
|
℃/min
|
150/15-30
|
|
operating time at room temperature
|
hrs./(25℃)
|
48
|
|
storage time
|
months./(-10℃-0℃)
|
6
|
|
density
|
g/cm3
|
1.1
|
|
hardness
|
shore a
|
58-63
|
|
shear strength
|
mpa
|
>1.8
|
|
tensile strength
|
mpa
|
>3
|
|
mass resistivity
|
ω·cm/(23℃)
|
0.5×1014
|
|
relative dielectric constant
|
mhz
|
3.2
|
|
thermal conductivity
|
w/mk
|
0.7
|
|
coefficient of linear expansion
|
ppm/℃(α2)
|
210
|
l cob enclosure for led surface light
source for ideal wall shape；
l inner layer
bonding for ptc, bonding of electronic, electrical and instrument components；
l used for
bonding, bonding, and fixing various electronic components；
l good adhesion
and moderate strength;
l moisture-proof, waterproof, ozone-resistant, radiation-resistant,
weather-resistant, etc., can withstand high temperatures 260 ° c;
l heated and cured, and has good adhesion to substrates such as epoxy,
glass, and metal.
|
inspecting
item
|
unit / test
method
|
numerical
value
|
|
surface
|
——
|
white paste
|
|
dynamic viscosity
|
mpa·s/(25℃，10rpm)
|
45-55
|
|
tectonic
viscosity ratio
|
/(3rpm/30rpm)
|
>4
|
|
condition of
cure
|
℃/min
|
150/15-30
|
|
operating
time at room temperature
|
hrs./(25℃)
|
48
|
|
storage time
|
months./(-10℃-0℃)
|
6
|
|
density
|
g/cm3
|
1.0-1.1
|
|
hardness
|
shore a
|
58-60
|
|
shear strength
|
mpa
|
>1.8
|
|
tensile
strength
|
mpa
|
>3
|
|
mass
resistivity
|
ω·cm/(23℃)
|
0.5×1014
|
|
relative
dielectric constant
|
mhz
|
3.2
|
|
thermal conductivity
|
w/mk
|
0.7
|
|
coefficient of linear expansion
|
ppm/℃(α2)
|
210
|
l cob enclosure for led surface light
source for ideal wall shape；
l inner layer
bonding for ptc, bonding of electronic, electrical and instrument components；
l used for
bonding, bonding, and fixing various electronic components；
l good adhesion
and moderate strength;
l moisture-proof, waterproof, ozone-resistant, radiation-resistant,
weather-resistant, etc., can withstand high temperatures 260 ° c;
l heated and cured, and has good adhesion to substrates such as epoxy,
glass, and metal.
|
inspecting
item
|
unit / test
method
|
numerical
value
|
|
surface
|
——
|
white paste
|
|
dynamic viscosity
|
mpa·s/(25℃，10rpm)
|
35-45
|
|
tectonic
viscosity ratio
|
/(3rpm/30rpm)
|
>4
|
|
condition of
cure
|
℃/min
|
150/15-30
|
|
operating
time at room temperature
|
hrs./(25℃)
|
48
|
|
storage time
|
months./(-10℃-0℃)
|
6
|
|
density
|
g/cm3
|
1.0-1.1
|
|
hardness
|
shore a
|
55-60
|
|
shear strength
|
mpa
|
>1.8
|
|
tensile
strength
|
mpa
|
>3
|
|
mass
resistivity
|
ω·cm/(23℃)
|
0.5×1014
|
|
relative
dielectric constant
|
mhz
|
3.2
|
|
thermal conductivity
|
w/mk
|
0.7
|
|
coefficient of linear expansion
|
ppm/℃(α2)
|
210
|
