l two-component led silicone encapsulant, mainly suitable for cob surface
light source packaging;
l good leveling, easy to inject glue;
l flat, smooth, no bubbles after curing;
l fast curing speed, good adhesion to white oil board.
project
|
technical
parameter
|
before curing(component
a)
|
surface
|
colorless transparent liquid
|
dynamic viscosity mpa·s(25℃)
|
3500 ± 500
|
before curing(component
b)
|
surface
|
colorless transparent liquid
|
dynamic
viscosity mpa·s(25℃)
|
3500 ± 500
|
use ratio
|
1:1
|
post-mixed viscosity mpa·s(25℃)
|
3500 ±500
|
typical curing conditions
|
150℃×1h
|
after curing
|
surface
|
colorless transparent elastic body
|
hardness(shorea)
|
45 ± 5
|
l two-component led silicone encapsulant, mainly suitable for cob surface
light source packaging;
l good leveling, easy to inject glue;
l flat, smooth, no bubbles after curing;
l fast curing
speed, good adhesion to white oil board;
project
|
technical
parameter
|
before curing(component
a)
|
surface
|
colorless transparent liquid
|
dynamic viscosity mpa·s(25℃)
|
7000 ± 1000
|
before curing(component
b)
|
surface
|
colorless transparent liquid
|
dynamic
viscosity mpa·s(25℃)
|
1500 ± 500
|
use ratio
|
1:1
|
post-mixed viscosity mpa·s(25℃)
|
4500 ±500
|
typical curing conditions
|
150℃×1h
|
after curing
|
surface
|
colorless transparent elastic body
|
hardness(shorea)
|
35 ± 5
|
l two-component led silicone encapsulant, mainly suitable for high power
cob/integrated module surface light source package;
l good leveling, easy to inject glue, smooth, smooth and free of bubbles
after curing;
l excellent high temperature resistance, can be used at 250 °c for a long
time, can withstand up to 300 °c;
l good adhesion to ppa, silver plated bracket,
white oil plate, mirror aluminum, ceramic substrate, etc.
project
|
technical
parameter
|
before curing(component
a)
|
surface
|
colorless transparent liquid
|
dynamic viscosity mpa·s(25℃)
|
5500 ± 500
|
before curing(component
b)
|
surface
|
colorless transparent liquid
|
dynamic
viscosity mpa·s(25℃)
|
3500 ± 500
|
use ratio
|
1:1
|
post-mixed viscosity mpa·s(25℃)
|
4200 ±500
|
typical curing conditions
|
100℃×1h 150℃×2h
|
after curing
|
surface
|
colorless transparent elastic body
|
hardness(shorea)
|
32 ± 5
|