l two-component led silicone encapsulant, mainly suitable for cob surface
light source packaging;
l good leveling, easy to inject glue；
l flat, smooth, no bubbles after curing；
l fast curing speed, good adhesion to white oil board.
|
project
|
technical
parameter
|
|
before curing（component
a）
|
surface
|
colorless transparent liquid
|
|
dynamic viscosity mpa·s（25℃）
|
3500 ± 500
|
|
before curing（component
b）
|
surface
|
colorless transparent liquid
|
|
dynamic
viscosity mpa·s（25℃）
|
3500 ± 500
|
|
use ratio
|
1：1
|
|
post-mixed viscosity mpa·s（25℃）
|
3500 ±500
|
|
typical curing conditions
|
150℃×1h
|
|
after curing
|
surface
|
colorless transparent elastic body
|
|
hardness（shorea）
|
45 ± 5
|
l two-component led silicone encapsulant, mainly suitable for cob surface
light source packaging;
l good leveling, easy to inject glue；
l flat, smooth, no bubbles after curing；
l fast curing
speed, good adhesion to white oil board；
|
project
|
technical
parameter
|
|
before curing（component
a）
|
surface
|
colorless transparent liquid
|
|
dynamic viscosity mpa·s（25℃）
|
7000 ± 1000
|
|
before curing（component
b）
|
surface
|
colorless transparent liquid
|
|
dynamic
viscosity mpa·s（25℃）
|
1500 ± 500
|
|
use ratio
|
1：1
|
|
post-mixed viscosity mpa·s（25℃）
|
4500 ±500
|
|
typical curing conditions
|
150℃×1h
|
|
after curing
|
surface
|
colorless transparent elastic body
|
|
hardness（shorea）
|
35 ± 5
|
l two-component led silicone encapsulant, mainly suitable for high power
cob/integrated module surface light source package;
l good leveling, easy to inject glue, smooth, smooth and free of bubbles
after curing;
l excellent high temperature resistance, can be used at 250 °c for a long
time, can withstand up to 300 °c;
l good adhesion to ppa, silver plated bracket,
white oil plate, mirror aluminum, ceramic substrate, etc.
|
project
|
technical
parameter
|
|
before curing（component
a）
|
surface
|
colorless transparent liquid
|
|
dynamic viscosity mpa·s（25℃）
|
5500 ± 500
|
|
before curing（component
b）
|
surface
|
colorless transparent liquid
|
|
dynamic
viscosity mpa·s（25℃）
|
3500 ± 500
|
|
use ratio
|
1：1
|
|
post-mixed viscosity mpa·s（25℃）
|
4200 ±500
|
|
typical curing conditions
|
100℃×1h 150℃×2h
|
|
after curing
|
surface
|
colorless transparent elastic body
|
|
hardness（shorea）
|
32 ± 5
|
