main feature:
ladapt to high-precision smt process requirements；
lexcellent wettability and continuous printing,suitable for placement of fine pitch devices (qfp, etc.).
wide process window
llowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency
lhigh adhesion, keep the components attached
robust reflow performance
lwide process window, making the reflowtemperature curve flexible；
l bestwetting on all conventional substrate surfaces.
good welding effect
lgoodthermal collapse, no tin beads, no bridge defects, few residues andtransparent.；
lthe surface of the solder joint is bright, lesswrinkled, and low void.
ladapt to high-precision smt process requirements；
lexcellent wettability and continuous printing,suitable for placement of fine pitch devices (qfp, etc.)
wide process window
llowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency；
lhigh adhesion, keep the components attached.
robustreflow performance
lwide process window, making the reflowtemperature curve flexible；
l bestwetting on all conventional substrate surfaces；
good welding effect
lgoodthermal collapse, no tin beads, no bridge defects, few residues andtransparent.
lthe surface of the solder joint is bright, lesswrinkled, and low void.
luse tin-bismuthhigh-temperature solder powder for soldering electronic components forhigh-temperature work or circuit boards or integrated modules requiringsecondary reflow soldering；
l strongmoisturizing ability, good solder wettability to various devices and pads.
wide process window
llowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency；
lhigh adhesion, keep the components attached.
robust reflow performance
lwide process window, making the reflowtemperature curve flexible；
l bestwetting on all conventional substrate surfaces.
good welding effect
lgoodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
lthe surface of the solder joint is bright, lesswrinkled, and low void.
