øes-500 series high lead solder paste
main feature:
l rohs instruction is exempt from solder;
lapplicable to power tube, diode, triode,rectifier bridge, small integrated circuit and other power semiconductorprecision components package soldering;
wideprocess window
llowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency;
lhigh adhesion, keep the components attached
robust reflow performance
lwide process window, making the reflowtemperature curve flexible;
l bestwetting on all conventional substrate surfaces.
good welding effect
lgoodthermal collapse, no tin beads, no bridge defects, few residues andtransparent;
lthe surface of the solder joint is bright, lesswrinkled, and low void.
øes-650 series high
lead solder paste
main feature:
l rohs instruction is exempt from solder;
l applicable to power tube, diode, triode,
rectifier bridge, small integrated circuit and other power semiconductor
precision components package soldering;
wide process window
l low
volatile solvent system, good thixotropy, wide operating window, consistent
operation consistency;
l high adhesion, keep the components attached;
robust reflow performance
l wide process window, making the reflow
temperature curve flexible;
l best wetting on all conventional substrate
surfaces.
good welding effect
l good
thermal collapse, no tin beads, no bridge defects, few residues and
transparent.
l the surface of the solder joint is bright, less
wrinkled, and low void
lrohs instruction is exempt from solder;
lapplicable to power tube, diode, triode,rectifier bridge, small integrated circuit and other power semiconductorprecision components package soldering.
wide process window
llow volatilesolvent system, good thixotropy, wide operating window, consistent operationconsistency;
lhigh adhesion, keep the components attached.
robust reflow performance
lwide process window, making the reflowtemperature curve flexible;
l bestwetting on all conventional substrate surfaces;
good welding effect
lgoodthermal collapse, no tin beads, no bridge defects, few residues andtransparent;
lthe surface of the solder joint is bright, lesswrinkled, and low void