øes-500 series high lead solder paste
main feature:
l rohs instruction is exempt from solder；
lapplicable to power tube, diode, triode,rectifier bridge, small integrated circuit and other power semiconductorprecision components package soldering；
wideprocess window
llowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency；
lhigh adhesion, keep the components attached
robust reflow performance
lwide process window, making the reflowtemperature curve flexible；
l bestwetting on all conventional substrate surfaces.
good welding effect
lgoodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
lthe surface of the solder joint is bright, lesswrinkled, and low void.
øes-650 series high
lead solder paste
main feature:
l rohs instruction is exempt from solder；
l applicable to power tube, diode, triode,
rectifier bridge, small integrated circuit and other power semiconductor
precision components package soldering；
wide process window
l low
volatile solvent system, good thixotropy, wide operating window, consistent
operation consistency；
l high adhesion, keep the components attached；
robust reflow performance
l wide process window, making the reflow
temperature curve flexible；
l best wetting on all conventional substrate
surfaces.
good welding effect
l good
thermal collapse, no tin beads, no bridge defects, few residues and
transparent.
l the surface of the solder joint is bright, less
wrinkled, and low void
lrohs instruction is exempt from solder；
lapplicable to power tube, diode, triode,rectifier bridge, small integrated circuit and other power semiconductorprecision components package soldering.
wide process window
llow volatilesolvent system, good thixotropy, wide operating window, consistent operationconsistency；
lhigh adhesion, keep the components attached.
robust reflow performance
lwide process window, making the reflowtemperature curve flexible；
l bestwetting on all conventional substrate surfaces；
good welding effect
lgoodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
lthe surface of the solder joint is bright, lesswrinkled, and low void
