lsuitable forhigh-precision smt process technology such as automotive electronics and mobilecomputer, with high reliability；
lstrongmoisturizing ability, good solder wettability to various devices and pads；
l the physical connection performance of solder joints isreliable, the chemical properties of resin residues are stable, and theelectrical parameters of high precision and high reliability are met.
suitable formicro components and fine pitch assembly
lmeet the ultra-fine pitch printing processrequirements
best printingperformance
llow volatilesolvent system, good moisture retention, wide operating window, consistentprinting consistency；
lhigh adhesion, keep the components attached.
robust reflowperformance
lwide process window, making the reflowtemperature curve flexible;
lbest wetting on all conventional substratesurfaces.
good weldingeffect
lgood thermalcollapse, no tin beads, no bridge defects, few residues and transparent.
lbright solder joint surface, less wrinkles,extremely low void rate, high reliability
ladapt to the laser welding process;
lstrong moisturizing ability, good solderwettability to various devices and pads;
lreliable physical connection performance ofsolder joints, stable chemical properties of resin residues.
good rheology
lsmooth adhesive, high-speed dispensing processfor laser welding;
higher activity
lthe rapid welding process can immediatelystimulate the activity required to release the weld.
high adhesion
linstant soldering process to agglomerate tinpowder, rarely producing splashes and solder balls.
good welding effect
lgood thermal collapse, no tin beads,no bridge defects, few residues and transparent;
lthe surface of the solder joint is bright, lesswrinkled, and low void.
ladapt to haba welding, hot air gun and solderingiron welding process;
lstrong moisturizing ability, good solderwettability to various devices and pads;
lreliable physical connection performance ofsolder joints, stable chemical properties of resin residues.
good rheology
lsmooth gluing, high-speed dispensing process forlaser welding.
higher activity
lthe rapid welding process can immediatelystimulate the activity required to release the weld.
high adhesion
linstant soldering process to agglomerate tinpowder, rarely producing splashes and solder balls.
good welding effect
lgoodthermal collapse, no tin beads, no bridge defects, few residues andtransparent;
lthe surface of the solder joint is bright, lesswrinkled, and low void.
lhigh-puritylead-free no. 6 (5-15um) solder powder for die bonding of various fine pitchpad sizes；
lsolid bonding of chips of 0509, 0410 and below；
lreliable physical connection performance ofsolder joints to meet high-precision, high-reliability electrical parameters.
wide operating window
lexcellentanti-oxidation formula design, good thixotropy, continuous and stable operationwindow time is more than 8h；
lhigh adhesion, keeping the components attached.
robust reflow performance
lwide process window, making the reflowtemperature curve flexible；
l bestwetting on all conventional substrate surfaces.
good welding effect
lgoodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
lthe surface of the solder joint is bright, lesswrinkled, and low void.
l high-purity lead-free no. 7 (2-10um) solderpowder for die bonding of various fine pitch pad sizes；
lsolid bonding of chips of 0509, 0410 and below；
lreliable physical connection performance ofsolder joints to meet high-precision, high-reliability electrical parameters.
wide operating window
lexcellentanti-oxidation formula design, good thixotropy, continuous and stable operationwindow time is more than 8h；
lhigh adhesion, keeping the components attached.
robust reflow performance
lwide process window, making the reflowtemperature curve flexible；
l bestwetting on all conventional substrate surfaces.
good welding effect
lgoodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
lthe surface of the solder joint is bright, lesswrinkled, and low void.
lhigh-purity lead-free no. 8 (2-8um) solderpowder for die bonding of various fine pitch pad sizes；
lsolid bonding of chips of 0509, 0410 and below；
lreliable physical connection performance ofsolder joints to meet high-precision, high-reliability electrical parameters.
wide operating window
lexcellentanti-oxidation formula design, good thixotropy, continuous and stable operationwindow time is more than 8h；
lhigh adhesion, keeping the components attached.
robust reflow performance
lwide process window, making the reflowtemperature curve flexible；
l bestwetting on all conventional substrate surfaces.
good welding effect
lgoodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
lthe surface of the solder joint is bright, lesswrinkled, and low void.
lsuitable for a wide range of high power led lampbead packages with coated metal chips；
lstrong moisturizing ability and good weldwettability；
l thesolder joint physical connection performance is reliable, the residue is verysmall, and the reliability is high.
best printing performance
llowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency；
lhigh adhesion, keep the components attached.
robust reflow performance
lwide process window, making the reflowtemperature curve flexible；
l bestwetting on all conventional substrate surfaces.
good welding effect
lgoodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
lthe surface of the solder joint is bright, lesswrinkled, and low void
lsuitable for a wide range of high power led lampbead packages with coated metal chips；
lstrong moisturizing ability and good weldwettability；
l thesolder joint physical connection performance is reliable, the residue is verysmall, and the reliability is high.
best printing performance
llowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency；
lhigh adhesion, keep the components attached.
robust reflow performance
lwide process window, making the reflowtemperature curve flexible；
l bestwetting on all conventional substrate surfaces.
good welding effect
lgoodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
lthe surface of the solder joint is bright, lesswrinkled, and low void.
