lsnag0.3cu0.7 low silver tin powder,cost-effective；
lstrong moisturizing ability, good solderwettability for various devices and pads；
lthe physical connection performance of solderjoints is reliable, the chemical properties of resin residues are stable, andthe electrical parameters of high precision and high reliability are met..
suitable for micro components and fine pitch assembly
lmeet the ultra-fine pitch printing processrequirements.
best printing performance
llowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency；
lhigh adhesion, keep the components attached.
robust reflow performance
lwide process window, making the reflowtemperature curve flexible；
l bestwetting on all conventional substrate surfaces
good welding effect
lgoodthermal collapse, no tin beads, no bridge defects, few residues andtransparent.；
lthe surface of the solder joint is bright, lesswrinkled, and low void.