ltin-bismuth low-temperature solder powder,suitable for medium and low temperature soldering process or secondary reflowprocess；
lstrong moisturizing ability, good solderwettability for various devices and pads.
wide process window
llowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency；
lhigh adhesion, keep the components attached.
robust reflow performance
lwide process window, making the reflowtemperature curve flexible；
l bestwetting on all conventional substrate surfaces.
good welding effect
lgoodthermal collapse, no tin beads, no bridge defects, few residues and transparent.
lthe surface of the solder joint is bright, lesswrinkled, and low void
ltin-bismuth low-temperature solder powder,suitable for medium and low temperature soldering process or secondary reflowprocess；
lstrong moisturizing ability, good solderwettability for various devices and pads.
wide process window
llowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency；
lhigh adhesion, keep the components attached.
robust reflow performance
lwide process window, making the reflowtemperature curve flexible；
l bestwetting on all conventional substrate surfaces.
good welding effect
lgoodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
lthe surface of the solder joint is bright, lesswrinkled, and low void.
ltin-silver-based low-temperature solder powder,suitable for medium and low temperature soldering process or secondary reflowprocess；
lstrong moisturizing ability, good solderwettability for various devices and pads.
wide process window
llowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency；
lhigh adhesion, keep the components attached.
robust reflow performance
lwide process window, making the reflowtemperature curve flexible；
l bestwetting on all conventional substrate surfaces.
good welding effect
lgoodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
lthe surface of the solder joint is bright, lesswrinkled, and low void.
ltin-bismuthlow-temperature solder powder, suitable for medium and low temperaturesoldering process or secondary reflow process；
lstrong moisturizing ability, good solderwettability for various devices and pads.
wide process window
llowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency；
lhigh adhesion, keep the components attached.
robust reflow performance
lwide process window, making the reflowtemperature curve flexible；
l bestwetting on all conventional substrate surfaces.
good welding effect
lgoodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
lthe surface of the solder joint is bright, lesswrinkled, and low void.
