lsuitable forall kinds of high-power led lamp bead packages with coated metal chips;
lstrong moisturizing ability and good weldwettability;
lthe solder joint physical connection performanceis reliable, the residue is very small, and the reliability is high.
lusingtin-bismuth high-temperature solder powder, it can be effectively used forhigh-temperature electronic component soldering or circuit board or integratedmodule requiring secondary reflow soldering.
best printing performance
llowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency;
lhigh adhesion, keep the components attached.
robust reflow performance
lwide process window, making the reflowtemperature curve flexible;
l bestwetting on all conventional substrate surfaces.
good welding effect
lgoodthermal collapse, no tin beads, no bridge defects, few residues andtransparent;
lthe surface of the solder joint is bright, lesswrinkled, and low void.