lsuitable forall kinds of high-power led lamp bead packages with coated metal chips；
lstrong moisturizing ability and good weldwettability；
lthe solder joint physical connection performanceis reliable, the residue is very small, and the reliability is high.
lusingtin-bismuth high-temperature solder powder, it can be effectively used forhigh-temperature electronic component soldering or circuit board or integratedmodule requiring secondary reflow soldering.
best printing performance
llowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency；
lhigh adhesion, keep the components attached.
robust reflow performance
lwide process window, making the reflowtemperature curve flexible；
l bestwetting on all conventional substrate surfaces.
good welding effect
lgoodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
lthe surface of the solder joint is bright, lesswrinkled, and low void.